Factors To Consider When Potting Electronics With Epoxy And Other Potting Materials

Potting involves submerging electronic assemblies in compound material, all applying it in selected areas. Potting offers protection against vibration, shock, moisture, and corrosive agents, among other hazards. Epoxy is one of the major materials used in this method, but there is the option of using polyurethane and silicone as well.

These potting materials have different properties making them ideal for different electronics, but what is common among them is that they offer great levels of protection to electrical components and assemblies. When you choose what is perfect for the electronics at hand, you will easily achieve long-lasting protection.

Whereas potting electronics with epoxy or other materials might sound like a simple process of pouring the materials into an enclosure and allowing it to cure for protection, some factors determine how perfect and effective the pot is. You must consider the factors below for best results when you use epoxy, polyurethane, or silicone.

Resin temperature – The flow temperature is essential in determining how easy the application process is and how consistent the final product is. Sometimes it is better to heat the resin before you can start potting. If unsure whether it is a good idea to heat the resin material you have selected, consult your supplier or manufacturer.

The two-part mixing ratio – Some potting resins come in two-part compounds: a hardener and the resin. The ratio you use to mix the potting materials will directly affect how hard or flexible the layer is. The potting product you select will usually come with mixing instructions, so you can refer to it or get assistance from your supplier.

On the other hand, you can use a cylinder piston machine to ease the measuring. Such a machine comes with cylinders for the two compounds, and the ratio will be pushed in the right ratio seamlessly into your mixing bowl or area. A gear pump can also make things easy for you to control the ratios.

Mixing force – After getting the right ratios, the next important factor is the mixing force. The pressure to combine the compounds should be right so you can achieve the perfect consistency. When the pressure is too low, the mixture might be uneven. By following the use instructions, it should not be that hard to get it right.

Dispense weight – The weight of potting compound dispensed should also be handled with care. The electronic assembly size should guide the weight because the last thing you want to do is overdo the layering so much that it is hard for the components to function effectively. Even when dealing with potting that shrinks after curing, you can’t overrun the potting material. You can achieve the desired weight or volume through one controlled shot or multiple shots.

Dispense speed – Besides paying attention to the weight, the dispense speed also matters. This is especially important to production lines handling large volumes of electronics that need potting. Applying the potting material in a controlled manner helps ensure consistency even in the overall curing of the layer.

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For more about factors to consider when potting electronics with epoxy and other potting materials,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/category/pcb-potting-material/ for more info.