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Using PCB smt underfill epoxy and bga underfill material for different applications Underfill applications make use of different adhesive compounds to fill up gaps that exist between PCBs and microchip packages. This is very important because different chip packages, like chip scale packages and ball grid arrays, have to be...

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Potting Material For Electronics And How To Choose The Best Potting can be defined as the process of filling an electronic assembly with a solid to enhance its resistance levels. It is also known as embedment and makes components and assemblies resistant to vibrations, shocks, corrosive agents, chemicals, water, and...

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Factors To Consider When Potting Electronics With Epoxy And Other Potting Materials Potting involves submerging electronic assemblies in compound material, all applying it in selected areas. Potting offers protection against vibration, shock, moisture, and corrosive agents, among other hazards. Epoxy is one of the major materials used in this method,...

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The Best Underwater Electrical Potting Compound And How To Use Potting is very important in keeping electrical components safe. The protective method has become popular in almost all fields, and underwater systems have not been left behind. Whether your systems are used underwater or face water exposure during operation, you...

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One Part Epoxy Vs Two-Part Epoxy — What Is The Best Epoxy Glue?

One Part Epoxy Vs Two-Part Epoxy -- What Is The Best Epoxy Glue? The right glue can do so much, including completing installations and projects and even repairing and mending items that are still usable and require just a few touch-ups. Those particularly passionate about DIY projects know the importance...

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The Advantages Of Electronic Potting Compound And Epoxy Potting Material

The Advantages Of Electronic Potting Compound And Epoxy Potting Material Electronic components need protection from harmful environmental hazards and mechanical elements. Potting is among the methods to achieve the protection levels needed, even for sensitive components. In this process, liquid compounds form a thick layer over the components that need...