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Deepmaterial is reactive hot melt pressure sensitive adhesive manufacturer and supplier,manufacturing one component epoxy underfill adhesives,hot melt adhesives glue,uv curing adhesives,high refractive index optical adhesive,magnet bonding adhesives,best top waterproof structural adhesive glue for plastic to metal and glass,electronic adhesives glue for electric motor and micro motors in home appliance
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How to find the right chip bonding adhesive for smart card chip and microchip In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly,...
An Overview Of BGA Underfill Process And Non Conductive Via Fill Flip chip packaging exposes chips to mechanical stress because of extensive coefficient thermal expansion mismatch between the silicon chips and the substrate. When there is a high thermal load, the mismatch stresses the chips, thus making reliability a concern....
Potting electronics with silicone for better performance If you want your electronics to give you great performances and to last, you should use silicones for encapsulation and potting. There are more electronics all around us today than ever before. These electronics have become a part of our daily lives in...
How to use a smt underfill epoxy adhesive in various applications Underfill is a liquid polymer type applied to PCBs after going through a reflow process. After the underfill is placed, it is then allowed to cure, encapsulating the bottom side of a chip covering fragile interconnected pads between the...
The need of adhesives glue for potting electronics Potting involves fillings done using an adhesive or potting compound. When this is done, the components are usually in a recess or housing that has to be filled with adhesive. Best structural epoxy adhesive glue manufacturers in china Why it’s needed Circuit boards have several...
Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages Flip chip is a method used to attach die. In this attachment method, the electrical connections between substrate and the chip are directly made through the inversion of the die with face down onto the package. Conductive bumps are...
Potting electronics pcb with epoxy potting compound and epoxy resin conformal coating Electronic assemblies have to be protected from a wide range of factors, such as corrosive agents, moisture thermal dissipation, shock, and vibration. The protection is achieved when we do pot. This process involves filling electronic assemblies with compounds...
Optical bonding adhesive options and benefits Optical bonding is where protective glass gets glued on a display to make it readable when installed in humid outdoor environments. If you were to use normal displays outdoors, many factors end up affecting readability. The common issues are condensation and fog within the...
The ideal waterproof underwater electrical potting compound for electronics Using an underwater potting compound helps you protect electrical devices, appliances, and electrical circuitry from water damage. It is important to find a reliable waterproof compound used for splicing cables and encapsulating security which needs to be immersed in water. There...
Using PCB smt underfill epoxy and bga underfill material for different applications Underfill applications make use of different adhesive compounds to fill up gaps that exist between PCBs and microchip packages. This is very important because different chip packages, like chip scale packages and ball grid arrays, have to be...
Things To Remember When Buying An Electronic Assembly Adhesive Glue And PCB Assembly Materials DeepMaterial UV curable and epoxies are some of the best for assembly and electronic usage. The adhesives have impressive cure time and viscosity, making them ideal in screen printing for different applications when only a small...
The appropriate encapsulating and potting material for electronic components and PCB When picking the right potting compound, it is easy for an expert to note the concerns and make some material recommendations. An expert can also provide materials for testing and give information regarding the dielectric strength, thermal conductivity, and...
