Description
Product Specification Parameters
| Product Series |
Product Name |
Application characteristics |
| Conductive silver glue |
DM-7110 |
The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic glue dispensing, has a good glue output speed, and improves the production cycle. |
| DM-7130 |
Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire It is suitable for automatic glue dispensing, with excellent glue output speed, and When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low. When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low. |
| DM-7180 |
Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems, The bonding work can be completed with the smallest dose of adhesive, which greatly saves production It is suitable for automatic glue dispensing, has a good glue output speed, and improves the production cycle. |
| Product line |
Product Series |
Product name |
Colour |
Typical viscosity
(cps) |
Curing time |
Curing method |
Volume resistivity(Ω.cm) |
Store/°C /M |
| Epoxy based |
Conductive silver glue |
DM-7110 |
Silver |
10000 |
@175°C
60min |
Heat curing |
〈2.0×10 -4 |
*-40/6M |
| DM-7130 |
Silver |
12000 |
@175°C
60min |
Heat curing |
〈5.0×10 -5 |
*-40/6M |
| DM-7180 |
Silver |
8000 |
@80°C
60min |
Heat curing |
〈8.0×10 -5 |
*-40/6M |
Product Features
| Highly conductive, thermally conductive, high temperature resistant |
Good dispensing and shape retention |
| Curing compound is resistant to moisture, heat, high and low temperatures |
No deformation, no collapse, no spreading of glue spots |
Product Advantages
Conductive silver glue is a one-component modified epoxy/silicone resin adhesive developed for integrated circuit packaging, LED new light source, flexible circuit board (FPC) and other industries. It can be used for crystal packaging, chip packaging, LED solid crystal bonding, low temperature soldering, FPC shielding and other purposes.
