Miconductor-Packaging-&-Testing-UV-Viscosity-Reduction-Special-Film

Semiconductor Packaging & Testing UV Viscosity Reduction Special Film

The product uses PO as the surface protection material, mainly used for QFN cutting, SMD microphone substrate cutting, FR4 substrate cutting (LED).

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Description

Product Specification Parameters

Product Model Product Type Thickness Peel Force Before UV Peel Force After UV
DM-208A PO+UV tack reduction 170μm 800gf/25mm 15gf/25mm
DM-208B PO+UV tack reduction 170μm 1200gf/25mm 20gf/25mm
DM-208C PO+UV tack reduction 170μm 1500gf/25mm 30gf/25mm